Quality Control

X-Ray inspection

X-ray test is a real-time non-destructive analysis to check the internal hardware components of the component. It mainly checks the lead frame of the chip, wafer size, gold wire bonding diagram, ESD damage and holes. Customers can provide good products for comparison. examine.

X-Ray inspection introduction:

X-ray (X-ray) detector uses low-energy X-rays without damaging the inspected item to quickly detect the inspected object. The high-voltage impact target is used to generate X-ray penetration to detect the internal structure quality of electronic components, semiconductor packaging products, and the welding quality of various types of solder joints of SMT.

X-Ray detection steps:

Confirm the test location and requirements of the sample type/material→Put the sample into the X-Ray fluoroscope inspection table for X-Ray fluoroscopy inspection→Picture judgment analysis→Mark the defect type and location.

Function Testing

The key function test is also called the main function test. Refers to performing various necessary logic or signal state tests under specific working conditions (ie, the normal use environment of the device, usually at room temperature) and the normal working state of the device.

This test is based on the original factory specifications and industry standards or specifications, designs feasibility test vectors or special test circuits, applies corresponding signal source input to the test samples, and analyzes specific conditions such as adjustment and control of peripheral circuits, signal amplification, or conversion matching. The logic relationship of the signal and the change state of the output waveform are used to detect the functional characteristics of the device.
Application Scope: Verification of key functions of all semiconductor devices.

Decapsulation

Opening (unsealing) is mainly to use instruments to corrode the package on the surface of the chip to check whether there is a wafer inside, the size of the wafer, the manufacturer's logo, the copyright year, and the wafer code to determine the authenticity of the chip.

Introduction to opening test

The decap test, also known as DECAP, is a destructive experiment. It uses chemical reagent methods or laser etching to remove the external package shell of the component to check the original logo, layout, process defects, etc. on the surface of the die. Testing is an auxiliary testing method.

Solderability Test

According to the test standard of the solderability test, this test mainly detects whether the soldering ability of the chip pins meets the standard.

Solderability test concept

In the process of assembling and soldering electronic products, poor selection of solderable ends or solder paste on circuit boards and components, and poor quality of flux will cause soldering problems, which directly affect the quality of the product. The main welding problems include poor wetting, bridging, cracks, etc., which will increase the workload of quality control and produce a lot of repairs, resulting in waste of manpower and financial resources, such as false welding, false welding and poor welding strength, which will directly lead to reliability. Sexual issues.

Lead free test

Electron microscope plus EDS (Energy Dispersive Spectrometer), image acquisition and analysis processor, waveform acquisition and processing analyzer, through electron beam bombardment to detect sample pins, surface material analysis, through the periodic table of chemical elements to analyze whether the chip is a lead-free product.

RoHS test

The product is divided into a single material and uniform material and then tested. Among them, lead, cadmium, mercury, hexavalent chromium, polybrominated biphenyls (PBB), polybrominated diphenyl ethers (PBDE) and other six hazardous substances meet the requirements of the RoHS directive, the highest Restriction standards: cadmium: 0.01% (100PPM); lead, mercury, hexavalent chromium, polybrominated biphenyls (PBB), polybrominated diphenyl ethers (PBDE) 0.01% (1000PM).